This is 尬而比居

2009年1月29日星期四

micro-FCPGA與micro-FCBGA之比較

micro-FCPGA

Micro-FCPGA封裝圖，處理器背面為針腳，並安裝了抗干擾用的電容

Short for micro-Flip Chip Pin Grid Array, micro-FCPGA is one of two Mobile Pentium III Processor-M packages (the other is micro-FCBGA). The micro-FCPGA package is a die facedown on an organic substrate. An epoxy material surrounds the die, forming a smooth fillet. The package uses 478 pins that are 2.03 mm long and .32 mm in diameter and has capacitors on the bottom.

micro-FCBGA

Micro-FCBGA封裝圖，處理器背面為錫球腳，正面安裝了用於抗干擾的電容

Short for micro-Flip Chip Ball Grid Array, micro-FCBGA is one of two Mobile Pentium III Processor-M packages (the other is micro-FCPGA). The micro-FCBGA package is for surface-mount boards and consists of a die facedown on an organic substrate. An epoxy material surrounds the die, forming a smooth fillet. Where the micro-FCPGA uses pins, this package uses small balls as the contact for the processor. The package uses 479 balls that are .78 mm in diameter and includes capacitors on the top.